Automated Semiconductor Production Line Equipment - China

An Automated Semiconductor Packaging and Testing Line is a fully integrated semiconductor manufacturing system that combines back-end packaging processes and final electrical testing into a continuous, automated production workflow.

It typically integrates die attach, wire bonding, flip-chip bonding, molding, curing, inspection, and automated test equipment (ATE) systems to ensure both physical assembly quality and electrical performance validation of semiconductor devices.

This system is widely used in advanced IC manufacturing, high-performance computing (HPC), automotive-grade semiconductors, memory chips, and AI chip production where high yield, reliability, and zero-defect quality are required.

System Architecture

The system is composed of two tightly coupled manufacturing subsystems:

1 - Semiconductor Packaging Module

Wafer dicing and die preparation system

High-precision die bonding equipment

Wire bonding / flip-chip interconnect system

Transfer molding and encapsulation unit

Curing and thermal stabilization module

2 - Semiconductor Testing Module

Automated Test Equipment (ATE) integration

Wafer-level or package-level electrical testing

Functional and parametric test systems

Vision inspection (AOI / inline inspection)

Sorting and binning system

3 - Automation & Control Layer

Robotic wafer / device handling system

MES / ERP production integration

SPC real-time quality monitoring

AI-based process optimization engine

Smart factory (Industry 4.0) connectivity

End-to-End Process Workflow

Wafer dicing and die preparation

Automated die pick-up and placement

Die attach (epoxy / eutectic / flip-chip)

Wire bonding or interconnect formation

Molding and encapsulation process

Curing and thermal stabilization

Electrical and functional testing (ATE)

AOI / vision inspection

Sorting, marking, and final packaging

Data logging and traceability output

Applications

This integrated system is widely used in:

Integrated Circuit (IC) manufacturing

Advanced semiconductor packaging (2.5D / 3D IC, SiP)

Memory chips (DRAM, NAND, Flash)

Power semiconductors (IGBT, MOSFET)

RF and communication chips

Automotive-grade semiconductor devices

AI and HPC chip production

Consumer electronics semiconductor assembly Coreal Technology Co., Ltd. is a technology innovation enterprise specializing in power semiconductor packaging and testing equipment.

Founded in 2014, the company possesses fully independent intellectual property rights and is committed to providing customers with a one-stop full-line solution, ranging from process planning and key equipment to system integration.

Company Contact:

• Posted By: CHANGZHOU COREAL TECHNOLOGY CO.,LTD

• Phone: 0519-85382867

• Address: 122 Hanjiang Road, Xinbei District, Changzhou , Jiangsu , China

• Email:

• Business Description: Coreal Technology Co.,Ltd, founded in 2014, is a technology innovation enterprise specializing in the field of power semiconductor packaging and testing.
  
  With full independent intellectual property rights, the company has successfully mastered the entire power semiconductor packaging process, offering a one-stop, full-line solution that covers solution planning, key equipment, and system integration.
  
  Core business encompasses: independently developing core process equipment for various packaging stages, vision inspection systems, and automated production lines, achieving technological breakthroughs and mass production of key equipment, and providing customers with efficient and reliable comprehensive smart manufacturing services.