Thermal Bonding Machine - China

Coreal Tech provides advanced thermal bonding machines for semiconductor packaging, thermo-compression bonding, flip chip assembly, and high-precision IC packaging applications.

Our systems deliver accurate temperature control, stable bonding pressure, and high alignment precision for advanced semiconductor manufacturing.

Integrating chip preheating and thermal bonding functions in one unit, the equipment achieves high-precision chip mounting under high-precision visual guidance by virtue of closed-loop pressure control technology.

It can be connected to the MES (Manufacturing Execution System) for online recipe management, effectively controlling the overall production efficiency.

Suitable for high-precision chip bonding in optical modules, AR glasses, sensors and other industries.

Technical Specifications

Equipment dimensions 1430× 1640× 1750mm

Equipment weight 1900kg

Chip size 1× 1mm - 18× 18mm; Thickness: 50- 200μm

Positioning accuracy ±10μm

Production cycle 2S/c

What Is a Thermal Bonding Machine?

A thermal bonding machine is specialized semiconductor packaging equipment used to create reliable electrical and mechanical interconnections between semiconductor dies, substrates, wafers, and electronic components through controlled heat and pressure.

Thermal bonding technology is widely used in advanced semiconductor packaging processes including:

Thermo-Compression Bonding (TCB)

Flip Chip Packaging

Wafer-Level Packaging

2.5D/3D IC Packaging

Heterogeneous Integration

Chip-to-Substrate Bonding

As semiconductor devices continue toward smaller nodes and higher integration density, thermal bonding technology has become increasingly important for achieving ultra-fine pitch interconnects and high-reliability packaging.

Company Contact:

• Posted By: CHANGZHOU COREAL TECHNOLOGY CO.,LTD

• Phone: 0519-85382867

• Address: 122 Hanjiang Road, Xinbei District, Changzhou , Jiangsu , China

• Email:

• Business Description: Coreal Technology Co.,Ltd, founded in 2014, is a technology innovation enterprise specializing in the field of power semiconductor packaging and testing.
  
  With full independent intellectual property rights, the company has successfully mastered the entire power semiconductor packaging process, offering a one-stop, full-line solution that covers solution planning, key equipment, and system integration.
  
  Core business encompasses: independently developing core process equipment for various packaging stages, vision inspection systems, and automated production lines, achieving technological breakthroughs and mass production of key equipment, and providing customers with efficient and reliable comprehensive smart manufacturing services.