docbond underfill Photos Catalog - page 2 - ECeurope Market
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Docbond Conductive AdhesiveFuels - Huizhou DOCBOND NEW MATERIAL CO.,LT - China - April 19, 2023 - 30.00 Dollar US$
DB382 This product is a single component epoxy conductive adhesive with Conductive material as the medium. It is characterized by high purity, high conductivity, low modulus and long service life. The product has good storage stability, low curing te...
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Docbond Uv Cure AdhesiveFuels - Huizhou DOCBOND NEW MATERIAL CO.,LT - China - April 19, 2023 - 20.00 Dollar US$
DB790 This product is a one component UV curing adhesive with excellent adhesion to PC, PMMA, glass and other substrates. It has the characteristics of high bonding strength, low volatility, low shrinkage, low water absorption, strong adaptability an...
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Docbond Two Component Structural AdhesiveFuels - Huizhou DOCBOND NEW MATERIAL CO.,LT - China - April 19, 2023 - 200.00 Dollar US$
DB3030 SE This series of products have high structural bonding strength. In the shear strength test in the laboratory, the bonding property of this product is stronger than that of steel strip. The product is an epoxy adhesive that can firmly bond wo...
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Docbond High Thermal Conductivity Epoxy AdhesiveFuels - Huizhou DOCBOND NEW MATERIAL CO.,LT - China - April 19, 2023 - 200.00 Dollar US$
DB118 This product is a one-component epoxy resin adhesive with high thermal conductivity, which is the best matching adhesive for thermal bonding of chips. Applicable to all kinds of electronic products, characterized by rapid thermal curing, and ea...