Thermal Gel Substitutes For Chomerics Therm A Gap Gel60 - China

GLPOLY The thermal gel XK-G60 is a high performance thermal management solution for electronics assembly, it is thermally conductive particle filled silicone gel with high conformability and thermally conductive properties.

XK-G60 is formulated to accommodate todays high performance electronics requirements and designed to transfer a high degree of heat away from hot components to heat sink.

Chomerics THERM-A-GEL 60

It is a fully cured, no pump out, auto dispensable thermal interface material designed to replace conventional thermal conductive gap filler or pad.

Simply dispense thermal gel onto component, assemble heat sink over it, and the product is ready to go.

It is ideal for rework and maintainment situation.

This thermal gel does not require mixing and cure cycle, auto-dispensing process can reduce the assembly time and cost, which make the design more flexible.

Chomerics THERM-A-GEL 60

With ultra soft properties, this thermal gel can easily deflect under very low compression force and will fill voids and uneven surfaces, accommodating a variety of bond line thickness.

Thermal gel XK-G60 will also wet out matting surfaces in order to efficiently transfer heat from components to the heat sink.

Thermal gel XK-G60 can be stored at room temperature without any filler settling issues and is supplied in one-part, it is alternative toChomerics THERM-A-GEL 60.

Company Contact:

• Posted By: Goldlink Tongda Electronics Co., Ltd

• Phone: +8675527579310

• Address: Block 45, Baoan Shenzhen China, Shenzhen , Guangdong , China

• Email:

• Website: https://www.glpoly.com

• Business Description: Goldlink Tongda Electronics Co., Ltd is committed to the design, development and manufacture of Thermal Interface Materials, developing high quality TIMs and Thermal Solution is our first priority.
  
  Our outstanding R&D team are able to deliver the effective thermal solutions to customers for facing current advanced products.
  
  Products
  
  Busin ess includes Thermal Silicone Pad, Silicone Putty Pad, Thermal Tape, Thermal Silicone Grease, Two-part Thermal Gap Filler, Thermal Gel, Phase Change Materials and Non-Silicone based products.
  
  
  
  Applications
  
  We serve a multitude of industries worldwide including New energy vehicles, UAV, computer, telecommunications, consumer electronics, optical products, LED lighting, air flight, storage device, military and medical equipment, power conversion.