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  • Thermal Pad Alternative To Bergquist Gp 5000s35 - China

    price: 1.20 Dollar US$

    GLPOLY thermal pad is featuring a high thermal conductivity of 6.0W/mK, its higher than that of most of competitor.

    Compared with Bergquist gap pad 5000S35, the data will shows that GLPOLY thermal gap filler pad can perfectly substitute for the BQ 5000S35.

    Firstly, the thermal conductivity of GLPOLY thermal gap filler pad is higher that that of BQ 5000S35; the thermal resistance is only 0.16℃in2/W, its just one third of BQ 5000S35 - Comparison data reflects that GLPOLY thermal gap filler pad offers more excellent thermal performance than BQ5000S35.

    For the electrical property, the dielectric breakdown voltage is 16KV, its 3 times greater than BQ 5000S35s.

    this will ensure the stability of performance of devices.

    The material yields extremely soft characteristics while maintaining elasticity and conformability.

    Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile components.

    The inherent natural tack on both sides assists in application and allows the products to effectively fill gaps, reducing thermal resistance and enhancing the overall thermal performance.

    GLPOLY thermal gap filler pad is ideal for high-performance application at low stress or pressure.


    Company Contact:


    • Phone: +8675527579310

    • Address: Block 45, Baoan Shenzhen China, Shenzhen , Guangdong , China

    • Email: Email


    Published date: November 25, 2019

    • Business Description: Goldlink Tongda Electronics Co., Ltd is committed to the design, development and manufacture of Thermal Interface Materials, developing high quality TIMs and Thermal Solution is our first priority.

      Our outstanding R&D team are able to deliver the effective thermal solutions to customers for facing current advanced products.

      Products

      Busin ess includes Thermal Silicone Pad, Silicone Putty Pad, Thermal Tape, Thermal Silicone Grease, Two-part Thermal Gap Filler, Thermal Gel, Phase Change Materials and Non-Silicone based products.



      Applications

      We serve a multitude of industries worldwide including New energy vehicles, UAV, computer, telecommunications, consumer electronics, optical products, LED lighting, air flight, storage device, military and medical equipment, power conversion.

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