Ultra Thin Peelable Copper Foil Carrier - China
price: 12.00 Dollar US$
Ultra-Thin Peelable Copper Foil Ultra-Thin Peelable Copper Foil TD-FEC is ultrathin copper foil produced using vacuum sputtering and electro-deposition technology, Mainly used in IC packaging, FPC micro line.
Structure and size of copper can be customized.
Product Characteristics: 1 - Peelable ultrathin copper foil and superior heat stability.
2 - Low surface profile, high elongation and tensile strenth.
Yancheng Tiandi Insulation Co., Ltd.
Company Contact:
- Posted By: Yancheng Polyimide Insulation Co.,Ltd.
- Phone: 86-139-61986280
- Address: no.12 road, http://www.polyimide-pi.com, yancheng , jiangsu , China
- Email:

- Website: https://www.polyimide-pi.com
Published date: September 18, 2024
- Business Description: High-performance materials,high-performanc e plastics,High temperature polyimide,similar vespel polyimide,high performance polymers,polyimide tubing,polyimide sheet,polyimide foam,polyimide fiber,polyimide yarn,polyimide fpc,polyimide fpc fccl,polyimide rod,polyimide parts,polyimide powder,polyimide varnish in china.
1)Polyimide Film Based FCCL--3 Layer FCCL
2)Adhesiveless Single-Sided Copper Clad Laminate-- 2 Layer FCCL , 2-layer flexible circuit boards
3)Adhesiveless Double-Sided Copper Clad Laminate-- 2 Layer FCCL
4)Conductive Adhesive Film
5)EMI Shielding Film(Electromagnetic Interference Shielding Film)
6)Ultrathin FCCL
7)Ultra-Thin Peelable Copper Foil
8)Composite Lithium-ion Battery Copper Foil
9)TRF Embedded Resistor Film
10)Very Low Profile Copper Film(HVLP)---hvlp(hyper very low profile) copper foil
11)LCP FCCL(Single Side Double Side)--2L FCCL
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