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Laird Tflex 300 - China

price: 1.00 Dollar US$

Laird Tflex 300 Tflex 320 H Laird Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness.

This high rate of compliancy allows the material to totally blanket the component, enhancingthermal transfer.

The material has a very low compression set enabling the pad to be reusedmany times.

Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance.

With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at lowpressures.

Tflex 300-H is offered with a hard, metallized liner option for easy handling and improvedrework.

The metallized liner lower coefficient of friction also allows for easy assembly ofparts that must slide together, such as a card into a chassis.

PART NUMBER SYSTEM Tflex indicates Laird elastomeric thermal gap filler product line.

3xxx indicates Tflex 300 product line with thickness in mils (0.001”) EXAMPLES: • Laird Tflex 340 = 0.040 inch thick Tflex™ 300 material • Laird Tflex 380DC1 = 0.080 inch thick Tflex™ 300 material with DC1 coating • Laird Tflex 3120TG = 0.120 inch thick Tflex™ 300 material with Tgard™ liner • Laird Tflex 3200H = 0.200 inch thick Tflex™ 300 material with hard PET liner

Company Contact:

  • Phone: 13798203669

  • Address: Building F3, Jinyucheng Park, Longgang District, Shenzhen , Guangdong , China

  • Email: Email

Published date: February 14, 2022

  • Business Description: Shenzhen Hothree Technology Co., Ltd. was established in 2011 - It is a technology-oriented company that is oriented to customer needs and is committed to providing customers with professional solutions for thermal conduction and EMI electromagnetic compatibility problems.

    The company mainly distributes thermal interface materials and shielding (EMI) materials for well-known brands such as Bergquist ,LAIRD in the US and Denka in Japan.

    At the same time, the company is also developing and integrating new high-performance products to meet system designers' requirements for thermal conductivity.

    Products are widely used in 5G communications, optical modules, security electronics, automotive electronics, outdoor base stations, lithium batteries, mobile phones, computers, LED, instruments, aerospace and medical equipment.

    Company culture, Integrity and pragmatism, quick response, keep improving.

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