Bergquist Gap Pad Tgp Hc3000 - Chinaprice: 1.00 Dollar US$
Bergquist gphc3.0, gap pad hc 3.0, gap pad tgp hc3000 bergquist gap pad tgp hc3000 is a soft and compliant gap filling material with a thermal conductivity of 3.0 w/m-k.
the material offers exceptional thermal performance at low pressures due to a unique 3.0 w/m-k filler package and lowmodulus resin formulation.
the enhanced material is ideal for applications requiring low stress on components and boards during assembly.
bergquist gphc3.0 maintains a conformable nature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness and/or topography.
- Posted By: Shenzhen hothree technology co., LTD
- Phone: 13798203669
- Address: Building F3, Jinyucheng Park, Longgang District, Shenzhen , Guangdong , China
- Website: http://www.tim-home.com
Published date: February 14, 2022
- Business Description: Shenzhen Hothree Technology Co., Ltd. was established in 2011 - It is a technology-oriented company that is oriented to customer needs and is committed to providing customers with professional solutions for thermal conduction and EMI electromagnetic compatibility problems.
The company mainly distributes thermal interface materials and shielding (EMI) materials for well-known brands such as Bergquist ,LAIRD in the US and Denka in Japan.
At the same time, the company is also developing and integrating new high-performance products to meet system designers' requirements for thermal conductivity.
Products are widely used in 5G communications, optical modules, security electronics, automotive electronics, outdoor base stations, lithium batteries, mobile phones, computers, LED, instruments, aerospace and medical equipment.
Company culture, Integrity and pragmatism, quick response, keep improving.
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