Bergquist Gap Pad Tgp 12000ulm - China

1 - Thermal conductivity: 12 W/m-K (ASTM D5470) 2 - Exceptional thermal performance at low pressures 3 - Ultra-low modulus allows for excellent adhesion to rough surfaces 4 - Supplied with protective liners for ease of use 5 - High-compliance BERGQUIST GAP PAD TGP 12000ULM is an extremely soft gap filling material rated at a high thermal conductivity of 12.0 W/m-K.

It is specially formulated for high performance applications requiring low assembly stress.

The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation.

BERGQUIST GAP PAD TGP 12000ULM is highly conformal to rough or irregular surfaces, allowing excellent wet-out at the interface.

Protective liners are supplied on both sides allowing for ease of use.

The material is available in either gray or red color to meet customer requirements.

TYPICAL APPLICATIONS 1 - Telecommunications (routers, switches, base stations) 2 - Optical transceivers 3 - ASICs and DSPs TYPICAL PROPERTIES OF CURED MATERIAL Color Grey Physical Properties Hardness, Shore 000, ASTM D2240 68 Inherent Surface Tack 2 Density, ASTM D792, g/cc 3.1 Heat Capacity, ASTM E1269, J/g-K 0.7 Shelf life, days 180 Young's Modulus kPa 103 (psi) (15) Electrical Properties Volume Resistivity, ASTM D257, ohm-meter 1.5×1012 Dielectric Constant, ASTM D150, 1, 000Hz 8.4 Dielectric Breakdown Voltage: 0.04 inch sample, VAC 6, 200 Thermal Properties Thermal Conductivity, ASTM D5470, W/(m-K) 12 Material solutions for cloud recommends BERGQUIST GAP PAD TGP 12000ULM Material solutions for cloud datacenter recommends BERGQUIST GAP PAD TGP 12000ULM Material solutions for hyperscale datacenter recommends BERGQUIST GAP PAD TGP 12000ULM Material solutions for switches recommends BERGQUIST GAP PAD TGP 12000ULM Material solutions for routers recommends BERGQUIST GAP PAD TGP 12000ULM Material solutions for servers recommends BERGQUIST GAP PAD TGP 12000ULM

Company Contact:

• Posted By: Shenzhen hothree technology co., LTD

• Phone: 13798203669

• Address: Building F3, Jinyucheng Park, Longgang District, Shenzhen , Guangdong , China

• Email:

• Website: http://www.tim-home.com

• Business Description: Shenzhen Hothree Technology Co., Ltd. was established in 2011 - It is a technology-oriented company that is oriented to customer needs and is committed to providing customers with professional solutions for thermal conduction and EMI electromagnetic compatibility problems.
  
  The company mainly distributes thermal interface materials and shielding (EMI) materials for well-known brands such as Bergquist ,LAIRD in the US and Denka in Japan.
  
  At the same time, the company is also developing and integrating new high-performance products to meet system designers' requirements for thermal conductivity.
  
  Products are widely used in 5G communications, optical modules, security electronics, automotive electronics, outdoor base stations, lithium batteries, mobile phones, computers, LED, instruments, aerospace and medical equipment.
  
  Company culture, Integrity and pragmatism, quick response, keep improving.